LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
Electronics Forum | Fri Nov 25 20:57:30 EST 2016 | sarason
You guessed right. Not hot enough to get good reflow. regards sarason
Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek
Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2018-10-18 08:02:28.0
What are the advantages of use nitrogen process for SMT reflow oven?
Parts & Supplies | Assembly Accessories
Qinyi Electronics Co.,Ltd
Parts & Supplies | Pick and Place/Feeders
label feeder for Yamaha YV,YS,SMT label feeder for logo Continuous work 72 hours without exception We have full range of SMT pick and place machine feeders, for FUJI,JUKI,SAMSUNG,YAMAHA,PANASONIC and so on,including pneumatic feeder,electric feed
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Technical Library | 2019-07-24 23:55:32.0
Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.
SMT Reflow Solder Oven for Soldering Components ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional o
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Heller Industries Inc. | https://hellerindustries.com/1913-mark-5-series-smt-reflow-oven/
× SMT Reflow Oven -1913 MK5 Best value SMT Reflow Oven in the market. Designed for Low Cost of ownership. 1913 Mark V Non-LGA 1913 Mark V LGA The ultimate high volume Surface Mount Technology production solution with belt speeds up to
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
-Free Soldering/Reliability Low Temperature Processing Low Volume/Prototype Non-Wet Open (NWO) Defects Package-on-Package Assembly Part Obsolescence Placement Printing Reflow Soldering/ Wave Soldering Rework and Repair of QFNs
