Industry News | 2018-04-09 10:49:39.0
(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
New Equipment | Cleaning Agents
CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS
Industry News | 2009-05-04 16:17:50.0
May 2009 � Techcon Systems, a leading global supplier of fluid dispensing systems and accessories, announces that it will present at the DELO Seminar on UV Adhesives in Eindhoven on the 6th May 2009. Techcon Systems' European Sales Manager for the OEM Division, Steve Collier, will present a paper on best practice dispensing of UV cure adhesives using precision dispensing systems.
Industry News | 2010-08-02 12:55:28.0
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce that its plastic adhesive tools are ideal for smoothing sealants and adhesives for many aerospace applications. With sealant scrapers manufactured from Celcon®, and spatulas from glass-filled Nylon, these unique tools guarantee not to damage delicate substrates found in the aerospace industry.
Industry News | 2017-01-24 10:55:12.0
BP 256 is YINCAE’s new ball attach adhesive product
Industry News | 2015-11-18 13:15:58.0
Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany.
Industry News | 2016-03-03 08:45:28.0
Henkel Adhesive Technologies today announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. A one-part, thermally conductive, liquid formable gel, Liqui-Form 3500 combines high thermal conductivity with process flexibility and excellent reliability.
Industry News | 2009-12-07 20:44:54.0
At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming entry-level rework system, the FINEPLACER® core.
Industry News | 2009-01-16 17:14:22.0
FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009
Industry News | 2014-06-30 14:25:43.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
