Industry News | 2010-11-02 10:42:48.0
Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.
Industry News | 2022-03-29 07:09:55.0
EVS International is pleased to announce that it has signed on Circuit Technology, Inc. (CTI) as its manufacturers' representative. Bob Doetzer will represent EVS' solder recover systems in North and South Carolina.
Industry News | 2022-04-06 10:13:58.0
EVS International is pleased to announce the appointment of ARK Manufacturing Solutions, LLC as its manufacturers' representative. Dave Murrin, President and principal owner of ARK Mfg., will represent EVS' solder recover systems in Arizona, New Mexico and Southern Nevada.
New Equipment | Solder Materials
Alpha has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies. The range includes no-clean, water-soluble and activated rosin fluxes in a variety of solder alloys. A
Industry News | 2013-06-06 19:12:21.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2012-07-25 10:17:38.0
AIM, will highlight its new NC259 Solder Paste
Industry News | 2012-09-13 14:02:26.0
AIMannounces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo,
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