Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
New Equipment | Solder Materials
We offer Lead Free Solder Wire and Halogen Free Solder Wire; OEM service is available. Alloy / FLUX F4 F10 Sn/Cu v v Sn/Ag v v
Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m
Electronics Forum | Tue Jul 24 03:26:45 EDT 2001 | winnifred
Dr. Lee, For lead-free wave soldering, we are recommended to use SnCu0.7, why not 0.8 or more ?? Since SnCu0.7 has eutectic melting point at 227 deg C, does it mean with more Cu or less Cu, the melting point will be higher ?? Also, in lead solderin
Electronics Forum | Tue Jun 27 08:38:03 EDT 2006 | cuculi54986@yahoo.com
I tried some SN100C from AIM... On only one array. It flowed well on the chips but did not like the finish on the SOT23's on the board. I did not have enough arrays to mess around, so we switched it over to SAC305 and had no issues. I'm guessing w
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
Industry News | 2021-02-05 09:31:21.0
The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
Technical Library | 2013-10-17 17:46:01.0
Although several commercial and experimental Pb-free solder alloys are available as replacements for Sn-Pb solders, the following families of solders are of particular interest and are the prevailing choices of industry: eutectic Sn-Ag, eutectic Sn-Cu, eutectic Sn-Zn, eutectic Bi-Sn, and Sn–In. Since the properties of the binary Pb-free solders cannot fully meet the requirements for applications in electronic packaging, additional alloying elements are added to improve the performance of these alloys. Thus, ternary and even quaternary Pb-free solders have been developed, such as Sn-Ag-Cu, Sn-Ag-Bi, and Sn-Zn-Bi solder...
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Product name: Solder Bar Product code: NAP100 Alloy composition: Sn/Cu0.7/Ni0.05 Packing: ≈700g/pcs, 20kg/box MOQ: 500KG Price: Contact us for best price Features: - Quality guarantee (R.O.C Patent No.1366495) - No recycle material - Less 20
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• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler
Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Creating Solder Joint Reliability
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. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf
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