Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Zetech was established in 1986 with the intention of supplying Industrial Equipment, Manufacturing Equipment, Consumable Materials, Software and Technical Support to the Electronics and Manufacturing Industry in South Africa.
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Rework & Repair Equipment
Solder, Desolder & Rework equipment from Chemtronics, Easy Braid, TechSpray, Xuron, Edsyn, Hakko, Hexacon, Metcal, OKI, PACE, Weller, Plato, BeauTech, CircuitWorks, Excelta, Menda, Aven. Desoldering Wick Iron & Pencil Stands Solder & Desolder I
Electronics Forum | Sun Nov 16 09:02:47 EST 2008 | davef
While we're unfamiliar with Swisstone, we accept: * Techspray Solder-Wik * Chemtronics Soder-Wick * NTE Solder Wick All of these [and Swisstone] look basically the same. We wonder if maybe they're all made by the same source and branded differently
Electronics Forum | Thu Nov 13 07:57:36 EST 2008 | alien
What type of solder wick do you use for cleaning up QFP pads after desoldering ? Many brands only wick well at the end, but not when laid flat over the pads. Swisstone brand (made in US) works best for me, but the suppliers seems to play hard to ge
Industry News | 2011-02-09 14:50:49.0
Manufacturing and quality engineers looking for solutions to process challenges will have an additional resource for answers with the new Process Defect Clinic at the IPC APEX EXPO conference and exhibition, April 12–14, 2011, in Las Vegas. Sponsored by IPC and the National Physical Laboratory (NPL), the free clinic will be held in booth 217 on the show floor to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2015-02-12 13:32:52.0
Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types. As PCBs often include both BGAs and simpler discrete devices, a lead-free rework capability should include a suitable soldering station and a BGA rework station. This article shows how such equipment can be adapted to overcome the lead-free issues and provide a successful reworking facility.
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_footprint-for-solderable-jumper_topic2089.xml
. Place a solder wick on the solder and apply the iron and the solder wick sucks up the solder and with a wire mesh touchup it should be clean to go
| https://pcbasupplies.com/anti-static-1/
printed circuit boards, computers, cell phones, or other electronics Easily removes solder from components or pads on a circuit board Concentrated fine copper braiding utilizes less length of wick for each desoldering... MSRP: Now: $142.10 Add to Cart
