Description Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fixtures and other specialty soldering fixtures.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
WAVE SOLDER PALLETS, PROCESS CARRIERS, REFLOW FIXTURES, SELECTIVE SOLDER FIXTURES, SURFACE MOUNT CARRIERS, CONFORMAL COATING FIXTURES, ADJUSTABLE FIXTURES, CUSTOM TOOLING AND FIXTURES, MACHINING SERVICES WWW.EMCGTI.COM Check out our FACEBOOK Pa
Electronics Forum | Tue Dec 17 13:42:04 EST 2002 | robf
There are a few emerging technologies that have been growing in popularity for the past few years. Pin through paste, press fit connectors and selective soldering machines seem to be displacing custom fixtures. Most of the mixed technology boards o
Electronics Forum | Mon Dec 02 16:01:15 EST 2002 | russ
If you can, attach athermocouple to the locations where you are getting solder balls. A previous product I had showed the same thing and we found that we had inadequate preheat leaving the liquid flux to splatter when it hit the wave. It could aslo
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Industry News | 2019-08-08 08:16:10.0
KIC today announced plans to exhibit in Booth 1C01 at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0
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Parts & Supplies | Pick and Place/Feeders
JUKI AF, AN electric feeder: AF24FS E5005706AB0, AF24FS-OP E5007706AB0 AF05HP E1001706AB0, AF081E E1002706AB0 AF081P E1004706AB0, AN081C E1009706AB0 AF16FS E4003706AB0, AF16NS E4004706AB0 AQ02HP 40042271, AF12FS E3003706AB0 JUKI FF electric fee
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
ETA SMT Automatic Vacuum and Magazine Loader If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB conveyor, PCB magazine loader, PCBA coatin
FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
Career Center | Grand Rapids, Michigan USA | Engineering,Maintenance,Management,Production,Research and Development,Technical Support
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems
responsive temperature control… C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture
| https://www.smtfactory.com/Fixture-Cleaning-Machine-pl3891050.html
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