Industry Directory | Distributor
Aerospace Sphere is a USA based distributor and supplier of genuine aircraft parts, NATO stock number parts and IT Hardware components at reasonable prices with immediate shipment.
Industry Directory | Distributor
EasySpheres is the exclusive worldwide provider of high quality, Kester solder spheres. We maintain a large inventory of sphere alloys and sizes, and since we specialize in the fulfillment of small orders, we are able to guarantee
New Equipment | Solder Materials
New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura
New Equipment | Solder Materials
Wide variety of BGA Solder Spheres available. View this months features on our website. Buy online while supplies last.
Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin
I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg
Electronics Forum | Thu Dec 23 16:42:52 EST 1999 | Wayne Bracy
Check out Aeroquip there website is www.aeroquip.com/spheres/default2.htm or contact MSD in New Hampshire at (603) 774-5894 Regards, Wayne Bracy
Used SMT Equipment | Visual Inspection
Key performance specifications Low PDL uncertainty ±0.002dB Low spectral ripple uncertainty: ±0.002dB High input power levels up to +40dBm with Integrating sphere Power Sensor Module, Optical Heads, Return Loss Module Sheets
Used SMT Equipment | In-Circuit Testers
Agilent 81623B Germanium or Silicon Optical Power Head Ge Optical Head 5mm Diameter Key performance specifications Low PDL uncertainty +/- 0.002dB Low spectral ripple uncertainty: +/- 0.002dB High input power levels up to +40d
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
Technical Library | 2020-07-02 01:14:44.0
Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests.
ALPHA® Preforms with solder paste adds solder volume.
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Career Center | Research Triangle Park, North Carolina USA | Sales/Marketing
Worldwide supplier of solderpaste, flux, adhesives and solder sphere's seeking Independant Manfacturers' Representatives for select protected territories in Illinois, Ohio, Pennsylvania, New York, New Jersey and the Provinces of Canada. Experience in
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
| http://etasmt.com/cc?ID=te_news_bulletin,2761&url=_print
. Enclosed voids can cause a displacement of electrical and thermal paths as well as a local concentration of power and heat. Additionally, gas voids are quick to form spheres in the solder gap, which could cause the tilting of chip components and a wedge-shaped solder gap
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. Since the flux is in constant contact with the solder powder, it is continually acting on the oxides on the surfaces of the solder powder or spheres, and this action reduces the activity levels of the fluxes
