Electronics Forum: tg of laminate 2019 (2)

Re: Baking of PCB's/Flexes

Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc

Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef

We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats

Industry News: tg of laminate 2019 (2)

Isola Expands Production of GETEK Materials in Germany to Support European OEMs

Industry News | 2014-02-18 10:31:01.0

Isola Group S.à r.l. announced today that GETEK® laminates and prepegs are now in production at its facility in Düren, Germany, which will shorten lead times to Isola's European customers.

Isola Group

Isola Expands Commercial Production of I-Speed(R) PCB Materials Into Asia

Industry News | 2013-12-18 15:18:53.0

Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.

Isola Group

Technical Library: tg of laminate 2019 (3)

The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains

Technical Library | 2013-01-09 18:31:54.0

The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes designed to reduce Z-axis expansion and improve the materials resistance to thermal excursions through primary attach and rework operations have also produced harder resin systems with reduced fracture toughness.

Celestica Corporation

The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity

Technical Library | 2019-02-20 16:35:24.0

The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion.

Sanmina-SCI

Express Newsletter: tg of laminate 2019 (148)

SMT Express, Issue No. 4 - from SMTnet.com

SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL

Partner Websites: tg of laminate 2019 (79)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

. SMTA JOURNAL ARTICLES: 1999 - Present Allow time for larger file downloads. YEAR    VOL.    TITLE AUTHOR 2019 32-3 Characterization of Soldered Plated Through Holes (PTHs

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins

Heller Industries Inc.


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