Industry Directory | Consultant / Service Provider
Equipment Maintenance Strategy and Equipment Reliability Improvement for maximum uptime and throughput
TEXMAC provides electronics manufacturers with assembly and test equipment designed to increase productivity and improve throughput. Our line of Takaya in-circuit flying probe testers are the World's most advanced and reliable fixtureless testers.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Convection Reflow Soldering Ovens Printed Circuit Board Reflow Soldering Ovens. Our new reflow oven offers enhanced efficiency and sustainability. With its low-height top shell, Industry 4.0 compatibility, and innovative flux management, it’s the id
Electronics Forum | Fri Jan 13 11:01:46 EST 2017 | emeto
Hello experts, We have a XPM3m reflow oven and for certain boards, the oven is the bottleneck. I am curious if someone knows how to increase the throughput by decreasing the distance between the boards in the oven. It has to be in the software somew
Electronics Forum | Sun Jan 15 23:39:34 EST 2017 | anhsang38
Dear Pro Pls. flowing these pictures.
Used SMT Equipment | Chipshooters / Chip Mounters
YAMAHA YG200 Refurbished High Speed SMT Machine Model YG200 Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum)
Used SMT Equipment | Pick and Place/Feeders
YAMAHA YG200 Refurbished High Speed SMT Pick And Place Machine Applicable PCB L330×W250 mm to L50×W50 mm Through-put (Optimum) 45,000 CPH, 0.08 sec/CHIP equivalent Mounting accuracy Yamaha's standard components Absolute accurac
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Parts & Supplies | Assembly Accessories
SMT FUJI NXT H12HS Pick and placing head P/N: UH03033 H12HS HEAD (AUTO BACKUP PIN EQUIPMENT) P/N: AA74A10 Throughput / CPH ： H12HS head 24500 CPH
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Parts & Supplies | Pick and Place/Feeders
Buy High-speed Modular Mounter FX-1R The High-speed Modular Mounter FX-1R is a traditional modular chip shooter driven at extreme speeds. Refinements in the drive system deliver real world improvements in actual throughput. ■ 33,00
Technical Library | 2023-01-17 17:35:07.0
After years of concentration on resolving productivity- related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world's leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 06 00:00:00 EDT 2022 - Thu Oct 06 00:00:00 EDT 2022 | ,
Your equipment warns before going down. Are you listening?
Events Calendar | Mon Aug 13 00:00:00 EDT 2018 - Wed Sep 12 00:00:00 EDT 2018 | ,
Improving dispensing yield
Career Center | Palmdale, California USA | Production
Help Senior Systems Technology be a leader in the contract manufacturing industry by acting as the Senior Process Engineer Responsible for leading the development, deployment and improvement of Surface Mount Technology (SMT) related processes. Identi
Career Center | Lynchburg, Virginia USA | Engineering
Engineer must conceive, develop and implement the processes, techniques and specify equipment required to manufacture & maintain high quality printed circuit board assemblies. Take a leadership position in providing guidance for other Process Enginee
Career Center | Nashville, North Carolina USA | Engineering,Maintenance,Management,Sales/Marketing,Technical Support
Screen Printer programming, maintenance, calibration Placment machine programming, mainteanance, calibration SMT Process and Manufacturing engineering Project Management New model introduction Supervision skills Training skills Leadership knowledge S
Career Center | Obour, Egypt | Engineering,Maintenance,Production
Ten years of experience in electronics assembly work for Toshiba Egypt and Iskraemeco Egypt • Researched, analyzed and selected production equipment. • Work within team to startup Iskraemeco’s new factory in Egypt. • L
Why Sacrifice Throughput For Change-over Time? SMTnet Express March 1, 2012, Subscribers: 24963, Members: Companies: 8801, Users: 32746 Why Sacrifice Throughput For Change-over Time? Getting the most out of your equipment in small batch
KD Electronics Ltd. | http://www.kundasmt.com/?list_32/6017.html
’ LED membrane control panelPneumatic clamps provided for magazine alignmentPneumatic pusher’s pressure regulatedHigh throughput with short magazine change-over timeSMEMA compatible Features Sturdy and stable design User friendly ‘soft touch
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