Industry Directory | Distributor / Manufacturer
Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.
Industry Directory | Consultant / Service Provider
InsulFab is the leader in PCB Tooling with 2 locations and unmatched engineering support we will provide the custom solution
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
The FKN Systek S100 is an economical PCB singulating saw for moderate production volumes and laboratory use. The diamond saw blade with the linear bearing positioning table to guide the PCB to be cut, allows for quick and clean singulation of PCB
Electronics Forum | Wed Apr 26 19:10:43 EDT 2023 | cyber_wolf
This machines support table looks similar to AP and UP machines. I believe MPM published the dimensions of the "H" tower that the dedicated plates bolts to. As far as the plate, they are typically (2) pieces with the inside hollowed out to allow for
Electronics Forum | Thu Oct 26 18:43:09 EDT 2000 | Christopher Noonan
I am looking for tooling plate manufactures. I am kind of new to the SMT process, well as far as tooling goes, and I am trying to find a machinist to make tooling plates for Fuji and Siemens placement machines. Does anyone have any recommendation f
Used SMT Equipment | Screen Printers
Specifications: Opti-Print 256P3 Machine Repeatability: â± .00025" Universal Magnetic 1st and 2nd Side Tooling: Included Maximum Printing Area: 16" x 16" Maximum Frame Size (OD): 23" x 23" Maximum Off-Contact: 1" Maximum Cycle Speed: 10-12 seconds Pr
Used SMT Equipment | Screen Printers
Specifications: Opti-Print 256P3 Machine Repeatability: â± .00025" Universal Magnetic 1st and 2nd Side Tooling: Included Maximum Printing Area: 16" x 16" Maximum Frame Size (OD): 23" x 23" Maximum Off-Contact: 1" Maximum Cycle Speed: 10-12 seconds Pr
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2003-04-08 14:01:01.0
Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.
Parts & Supplies | Pick and Place/Feeders
guiding plate cleaning tool DLM
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Parts & Supplies | Pick and Place/Feeders
DGPK0152 CP742 Tool Holder PLATE Model: FUJI Mounter Specification: DGPK0152 Part number: DGPK0152 Name: CP742 Tool Holder DGPH3010 CP742 743 T-Shaft Pole DGPH5650,DCPH0261,DGPH0090 FUJI CP7 Vacuum Tube DGPK0030 Cutter base for FUJI CP743
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2020-07-15 18:29:34.0
In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
ML-860 Two-axis plate splitter 1; Appearance size: (L)1100X(W)800X(H)1500 2; Tool size: round knife 125X30X3, 80X35X3. Straight knife 356X43.5X6 3; Tool material: imported high-speed steel 4; board size: L350XW300 5; Drive motor: Servo motor 6; Spl
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Career Center | Pullman, Washington USA | Engineering
The Opportunity: Schweitzer Engineering Laboratories (SEL) seeks a professional, innovative and detailed individual for our Manufacturing Engineer position. If you are looking for an opportunity to contribute your skills and abilities to our growing
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/electro-mechanical
, height sensors, vacuum-heated tooling plates, programming cameras, and more. Many options are available to meet your requirements when production volumes increase or new applications develop
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf
Bubble size is engineered with diffuser plates Minimum bubble path length sets the minimum level the bubbler can operate Auto refill ensures bubbler never drops below minimum level CONFIDENTIAL Zero VOC Exhaust Catalytic Oxidizers Catalytic Burn Boxes at each end of the oven remove all unused formic acid, carbon
