Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
Parts & Supplies | Repair/Rework
. This machine adopts industrial computer control, full automatic vision alignment system can acquire BGA and the PCB image through the CCD camera and collect them on the image positioning processing system, calculate the offset position and angle th
Parts & Supplies | Repair/Rework
PG-P6860 Main Features： 1、 The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid lo
Industry Directory | Manufacturer
Kaufmann Group Inc.is a world-class electronic contract manufacturer. We work to earn your business every day providing extensive design, engineering, and manufacturing.
Industry Directory | Manufacturer
Aqua Klean Systems primarily manufactures inline cleaners and DI water recirculation systems. We service many industries, but have extensive knowledge in the Electronic and Semiconductor Industries.
Used SMT Equipment | In-Circuit Testers
Custom Multiport Test Set, 75 Ohms The Agilent 87075B multiport test set dramatically reduces overall tune and test times because DUT only needs to be connected once to test multiple signal paths. Minimizing the number of connections also reduces o
Used SMT Equipment | In-Circuit Testers
Agilent 87075B Custom Multiport Test Set, 75 Ohms The Agilent 87075B multiport test set dramatically reduces overall tune and test times because DUT only needs to be connected once to test multiple signal paths. Minimizing the number of connect
Used SMT Equipment | General Purpose Test & Measurement
The 2975 pushes testing technology to a higher level. For Project 25 complete transmitter spectrum performance testing, swept antenna and transmission line testing and at-a-glance troubleshooting, the 2975 comes standard with a digitized 2.7 GHz spec
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.
Technical Library | 2018-03-05 11:17:31.0
In order to comply with RoHS and WEEE directives, many circuit assemblers are transitioning some or all of their soldering processes from tin-lead to lead-free within the upcoming year. There are no drop-in replacement alloys for tin-lead solder, which is driving a fundamental technology change. This change is forcing manufacturers to take a closer look at everything associated with the assembly process: board and component materials, logistics and materials management, solder alloys and processing chemistries, and even soldering methods. Do not expect a dramatic change in soldering behavior when moving to lead-free solders. The melting points of the alloys are higher, but at molten temperatures the different alloys show similar behaviors in a number of respects. Expect subtler changes, especially near the edges of a process window that is assumed based on tin-lead experience rather than defined through lead-free experimentation. These small changes, many of them yet to be identified and understood, will manifest themselves with lower assembly yields. The key to keeping yields up during the transition to lead-free is quickly learning what and where the subtle distinctions are, and tuning the process to accommodate them.
