Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef
From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
Industry News | 2003-05-29 08:13:34.0
Universal Instruments and Asymtek have formed a partnership that will place an Asymtek Millennium 2020 dispenser in Universal's new Technology Excellence Centre in Suzhou, China.
Industry News | 2010-04-20 11:20:20.0
NEPCON China 2010, one of the largest electronics manufacturing and surface mount industry events in China, has opened its doors in the Shanghai Everbright Conference and Exhibition Center. On the first day, the visitors flowed and the number of visitors has broken the record again. The event attracts overseas visitors from many Southeast Asia countries including India and Vietnam where the electronics industry is growing fast.
Parts & Supplies | Repair/Rework
Repair parts include: CPU circuit board repair and maintenance of the I / O board, servo circuit board repair, the image processing circuit board repair, industrial CCD camera repair, frequency converter repair, PLC repair, touch screen repair, laser
Technical Library | 2014-10-30 01:48:43.0
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed
, M. Anselm; Universal Instruments Corporation .
Technology Co., Tsinghua University This paper studies an
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