Electronics Forum | Fri Aug 20 12:54:11 EDT 1999 | Carol Zhang
| | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | Can any one tell me what I have to change in my SMT | | process (paste, reflow, etc) If any? | | I ran one
Electronics Forum | Fri Aug 20 14:22:02 EDT 1999 | Earl Moon
| | | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | | Can any one tell me what I have to change in my SMT | | | process (paste, reflow, etc) If any? | | | I
Electronics Forum | Wed Jun 10 18:50:36 EDT 1998 | Earl Moon
| | | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | | Example: | | | Screen Print = 45% of total defects | | | Component Placement = 25% of total de
Electronics Forum | Fri May 15 18:18:51 EDT 1998 | Earl Moon
| Help! | We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The
Electronics Forum | Wed Jul 21 13:18:19 EDT 2004 | patrickbruneel
Thomas, The first thing I would suggest you to do is identify the type of problem your dealing with �pinhole� or �blowhole� before you can take the appropriate action to correct the problem. A pinhole is a void or cavity caused by non-wettable part
Electronics Forum | Fri Feb 29 08:12:56 EST 2008 | davef
Solder paste suppliers often make recommendations on solder paste handling after removing it from the container [eg, jar, cartridge, etc]. For instance, Multicore Solder Paste Handling Guidelines, September 2004 says: As a general rule, paste that h
Electronics Forum | Tue Mar 04 08:56:38 EST 2008 | tonyamenson
I talked to a solder paste chemsist and found out a few things. From above (Dave F) states a test for solder paste involving reflow on a non-wettable surface. Commonly known as the solder ball test this test is performed all the time by paste manufa
Electronics Forum | Thu Apr 03 22:56:48 EDT 2008 | davef
Potential impacts of using expired solder paste are [University of Bolton]: * Changed paste rheology. Result: poor print quality * Loss of solvents. Result: reduced flux activity * Changed flux formulation. Result: More difficult to clean flux residu
Electronics Forum | Sun Jan 18 09:20:26 EST 2009 | davef
We're not sure of the condition of your solder paste. So, afte 24 hours, if it's: * Unused, in a reclosed container, maybe a week of life depending on the environment * Used, scrap A simple coalescence test can quickly determine the condition of sol
Electronics Forum | Mon Oct 15 08:15:41 EDT 2012 | scottp
Is the designer's concern that the parts will fall off when hanging upside down during reflow? We've been doing this for decades and our test if we think a part is marginal is to glue a 2nd (and sometimes 3rd) part to the back and send it through re
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