Electronics Forum | Thu Mar 06 10:43:49 EST 2008 | samir
Folks, what is the industry consensus? Which is the more popular lead-free, flat finish these days? Here's what I know from my experience. IAg: 1. Quality of finish is dependent on supplier 2. Can NOT be reworked. It is known that reworking t
Electronics Forum | Tue Feb 03 10:25:56 EST 2009 | milroy
Hi What is the surface finish you have? Following are true if you have HASL-LeadFree surface. I have had the same problem 3years ago and we did some micro-sectioning for further analysis, still the boards are functioning properly. But you have to
Electronics Forum | Thu May 09 12:06:06 EDT 2013 | pbarton
We run Zipatec 460's also. I presume that you are running Nitrogen? We have found that if the Nitrogen flow rate is too high into the conical nozzle collar it can be sufficient to disrupt the smooth flow of the solder as it runs down the wettable o
Electronics Forum | Fri Nov 08 17:49:05 EST 2013 | davef
First, it's a surprise that your failure analysis lab thought everything was OK with these boards. They look like shit. Second, a few years ago, there was a bunch of complaints about ENIG boards with issues similar to what you're observing. There wa
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Wed May 08 10:10:17 EDT 2019 | oskar
ZipaTec Select 460 I´m trying to get a misbehaving ZipaTec Select 460 to bend according to my will. There is the option to turn the nitrogen on when the pot reaches a set temperature (I believe 170°C) or when the wave turns on. I´m trying with the
Electronics Forum | Wed Sep 13 14:55:58 EDT 2000 | Mark S
Hi All -- I have read the IPC acceptability requirements of butt-joints, but haven't seen anything on how they're actually performed. I'm assuming we can trim a DIP package, and place the part onto paste immediately before relow (or hand-solder it l
Electronics Forum | Tue Jul 30 08:37:39 EDT 2002 | davef
When you talk about 'poor wetting', 'dewett', 'no wets', etc.; are you seeing solder pulling back or away from the pad? Please describe the condition. Dewetting. The condition in the solder joint in which the liquid solder has not adhered intimate
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