Full Site - : why components need to be baked (Page 9 of 9)

Need Expert Support - Popcorning

Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette

Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.

| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo

Re: Peelable solder stop

Electronics Forum | Tue Dec 29 17:42:27 EST 1998 | Dave F

| Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. | | The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. | W

Re: Solder Resist Solder balls

Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon

| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,

Sm t t t t t t net
Previous 4 5 6 7 8 9  

why components need to be baked searches for Companies, Equipment, Machines, Suppliers & Information



High Precision Fluid Dispensers
pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
Circuit Board, PCB Assembly & electronics manufacturing service provider

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Fully Automatic BGA Rework Station

Internet marketing services for manufacturing companies