New Equipment | Coating Equipment
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050Board size:50×50-650×370mmFeeder inputs:max.112placement capacity:47,000 CPHProduct description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5050,Board size:50×50-6
New Equipment | Test Equipment
Have a product that you need tested and configured to end-user requirements? Accu-sembly makes it easy for you by providing this service right on the production floor! Your assemblies straight from our floor to the testing department makes one less s
New Equipment | Solder Materials
Sometimes you have to attempt small soldering projects on small circuits that can be hard to see and you need items like a magnification lamp or a soldering microscope. StellarTechnical.com understands this and provides a fabulous array of lighting a
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
We work as an integrated extension of your manufacturing department in assembling surface mount and thru hole assemblies. On consignment basis or turn key, we will do our best to meet our manufacturing deadlines and ship JIT (Just In Time). When Qu
Model No.: K0481 Product Origin: China Price Terms: FOB Shenzhen Payment Terms: T/T in advance Delivery Lead Time: within 7 days Features: 1) Made of highly absorbent, non-woven fabrics for removing spills or misprints 2) Superb tensile strength
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
