Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp3.5™ and KappZapp4™ Silver solders to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 350°F - 500°F (176°C - 260°C). Learn m
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
WS/WE100-N1439��WT160-F450�� WS/WE150-P430�� WT150-T430�� WT250-S162��WL170-N122��WT170-N132��WT170- N430��WS/WE-170-N132��WT150-N162��WT150-N460��WS/WE-150-N132��WL150-N132��VS/VE-180-N132��VT180-N133��VL180-N162�� WL260-R270��WT260-R260��WS/WE260-S
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Features & Applications: 1 Ideal for wave soldering, insulating circuit board against high temperature 2 Temperature 500��F/260��C 3 Silicone adhesive leaves no residue 4 Sizes between 3mm to 500mm are available upon request
Features & Application: 1) Material: polyimide film 2) Imported organic silicone pressure - sensitive adhesive is introduced 3) High temperature resistant 4) Acid and alkaline resistant 5) Solvent resistant 6) Electrical insulation (Grade H) 7) Radia
New Equipment | Rework & Repair Equipment
Feature: 1. Adopt high standard materials(PLC, temperature table, heater) to allow better control of soldering/de-soldering process. 2. 3 independent heating areas from top to bottom. 3. (K Sensor) closed loop, independent heating 4. Protect the
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Kapton®tapes are polyimide polymers in the form of a film. Kapton?polyimide tapes are also known as high temperature tape or polyimide tape. Some of the characteristics of the Kapton®polyimide tape are: It maintains an excellent physical and electri
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