New SMT Equipment: adding flux before reflow (Page 1 of 1)

ETA S-Series High-End Reflow Ovens

ETA S-Series High-End Reflow Ovens

New Equipment | Reflow

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

ETA E-Series Lead-Free Reflow Ovens

ETA E-Series Lead-Free Reflow Ovens

New Equipment | Reflow

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto

New Equipment | Printing

SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p

I.C.T ( Dongguan ICT Technology Co., Ltd. )

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

ProBot Automatic Profiling System

ProBot Automatic Profiling System

New Equipment | Reflow

The Profiling Machine for your Profile Machine The ProBot automatically verifies whether each PCB is processed to specification in the reflow oven. The suspect PCBs then can be sent off to batch X-ray. Because the typical batch X-ray machine only in

KIC Thermal

Pyramax - Convection Reflow Oven

Pyramax - Convection Reflow Oven

New Equipment | Reflow

  BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi

BTU International

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

SEHO MWS 2300 - High-End Wave Soldering Machine

SEHO MWS 2300 - High-End Wave Soldering Machine

New Equipment | Wave Soldering

Maximum flexibility and performance - state of the art full tunnel nitrogen wave soldering system for demanding applications and high production volumes. Based on SEHO's worldwide leading nitrogen technology, the precision machine tooling and the m

SEHO Systems GmbH

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