New SMT Equipment: air heaters (Page 1 of 15)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

Heller 2043 MK7 SMT Reflow Oven

Heller 2043 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,

Qersa Technology Co.,ltd

Heller 2049 MK7 SMT Reflow Oven

Heller 2049 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2049 MK7 SMT Reflow Oven Heating Zones: Top 15/ Bottom 15PCB Width:50 - 560 mmProduct description: Heller 2049 MK7 SMT Reflow Oven, Heating Zones: Top 15/ Bottom 15, PCB Width:50 - 560 mm   Heller 2049 MK7 SMT Reflow Oven Heller 2049 MK7

Qersa Technology Co.,ltd

Heller 2156 MK7 SMT Reflow Oven

Heller 2156 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2156 MK7 SMT Reflow Oven Heating Zones: Top 17/ Bottom 17PCB Width:50 - 560 mmLength: 869cmProduct description: Heller 2156 MK7 SMT Reflow Oven, Heating Zones: Top 17/ Bottom 17, PCB Width:50 - 560 mm, Length: 869cm   Heller 2156 MK7 SMT R

Qersa Technology Co.,ltd

Heller 1913 MK7 SMT Reflow Oven

Heller 1913 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1913 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width:50 - 560 mmCool Zones: 3 Toplength: 590cmProduct description: Heller 1913 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width:50 - 560 mm, Cool Zones: 3 Top, le

Qersa Technology Co.,ltd

BGA Rework Station, Split Vision, High Resolution, Model SV560

BGA Rework Station, Split Vision, High Resolution, Model SV560

New Equipment | Rework & Repair Equipment

The model SV560 is has a high resolution optical system for placement of components as small as 1mm.  With it's rapid heat infrared area heater it can rework boards as large a 36" and 36 layers. High Resolution HDMI Vision System Fits Boards up t

Precision PCB Services, Inc

Heller 1809 MK7 SMT Reflow Oven

Heller 1809 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1809 MK7 SMT Reflow Oven Heating Zones: Top 8 / Bottom 8PCB Width:50 - 560 mmlength: 465cmProduct description: Heller 1809 MK7 SMT Reflow Oven, Heating Zones: Top 8 / Bottom 8, PCB Width:50 - 560 mm, length: 465cm   Heller 1809 MK7 SMT Ref

Qersa Technology Co.,ltd

Heller 1707 MK7 SMT Reflow Oven

Heller 1707 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1707 MK7 SMT Reflow Oven 7 Heating ZonesMax PCB Width: 56cmWeight: 1450KGDimension: 360x152x144cmProduct description: Heller 1707 MK7 SMT Reflow Oven, 7 Heating Zones, Max PCB Width: 56cm, Weight: 1450KG, Dimension: 360x152x144cm   Heller

Qersa Technology Co.,ltd

Ersa HOTFLOW 3/14e Reflow Oven

Ersa HOTFLOW 3/14e Reflow Oven

New Equipment | Reflow

Ersa HOTFLOW 3/14e Reflow Oven Working width: 45-516 mmProcess length: 3,345 mmHeated length: 2,610 mmCooling length: 735 mmWeight appr. 1,450 kgDimension: 4,770x1,201x1,375 mm   Ersa HOTFLOW 3/14e Reflow Oven Ersa HOTFLOW 3/14e Reflow Oven Dua

Qersa Technology Co.,ltd

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