New Equipment | Board Handling - Storage
Automatic Label Generation And Placement System For In-line PCB Production. PROMATION'S ELC-1100P automatic label placer is a versatile next generation system that allows for high resolution labels to be generated and placed onto circuit boards with
Specially For LED Chip Placement With Vision Centering. APP-N4-1200S is a high-speed LED surface mounting system equipped with four suction nozzles and single-cantilevered SMT head. It reaches the highest speed of 13,000 CPH. Its vision centering sy
T4 middle speed mounter used Genmany technology Product Description T4 unique feature : 1, The only one high precision pick and place machine that standardconfiguration can mount 0201 components 2, The max size of QFP:48*48mm 3, It can
Quick Overview High Precision,With Vaccum Cups SP-400 is a high precision semi-automatic solder paste printing machine, printing accuracy can reach +/- 0.5mm. Can print PCB area as 50 x 50 mm to 400 x 400mm, single and double side PCB .PLC and touch
High precision led strip, rgb strip 5050,5630,5730 module vision position pick and place machine Place head: double mounting head, 36 pieces sucking nozzles, 18 pieces sucking nozzles per head Min nozzle distance: 13.5MM Max PCB board size: 1200*30
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
