New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
New Equipment | Solder Paste Stencils
LaserJob has been manufacturing laser cut SMD stencils for last 20 years. In strained condition with a cutting opening of 20µm an aperture size accuracy of ±3µm and an aperture positioning accuracy of ±10µm is guaranteed for SMD - stencils. All laser
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
New Equipment | Solder Materials
NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time
New Equipment | Solder Materials
WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of
New Equipment | Solder Paste Stencils
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil with nano coating from LaserJob. The patented NanoWork - stencil from LaserJob is based on a laser cut SMD stencil. Since 2007 LaserJob coates SMD - stencils and step stencils in an in-house process. The NanoWork co
.gif)
winsouce.jpg)