New SMT Equipment: bga encapsulation (Page 1 of 2)

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

New Equipment | Dispensing

The NexJet® 8 Jetting System with patented ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-owner

ASYMTEK Products | Nordson Electronics Solutions

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

New Equipment | Dispensing

ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa

ASYMTEK Products | Nordson Electronics Solutions

ETA M3 Multi-Function LED Chip Shooter

ETA M3 Multi-Function LED Chip Shooter

New Equipment | Pick & Place

The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel

I.C.T ( Dongguan ICT Technology Co., Ltd. )

X-Scope 6000 Cabinet X-Ray Inspection System

X-Scope 6000 Cabinet X-Ray Inspection System

New Equipment | Inspection

130kV, 5 Micron Microfocus X-Ray Inspection System The X-SCOPE 6000 is digitally full programmable CNC controlled x-ray inspection system that allows operators to program inspection and measurement routines with point and click ease. Standard featu

SCIENSCOPE International

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

SMT 256B Solder Joint Encapsulant

SMT 256B Solder Joint Encapsulant

New Equipment | Materials

SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes

YINCAE Advanced Materials, LLC.

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

SMT and Thru-Hole PCB Assembly Services

SMT and Thru-Hole PCB Assembly Services

New Equipment |  

CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo

MEC Midwest

SMT 266 Solder Joint Encapsulant

SMT 266 Solder Joint Encapsulant

New Equipment | Materials

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat

YINCAE Advanced Materials, LLC.

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