New Equipment | Solder Materials
NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attach
New Equipment | Solder Materials
For BGA's and PCB Production and Rework Sphere Accurate to +/- .001, All standard sizes available Standard Sizes of Sphere's: .035" +/- .002 10SN/90PB High-Temp .030" +/- .001 63SN/37PB .022" +/- .001 63SN/37PB .016" +/- .001 63S
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
New Equipment | Rework & Repair Equipment
Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a
New Equipment | Rework & Repair Equipment
SemiPack offers BGA Reballing Services with speed, reliability and affordability that are unrivalled in the industry. The Restriction of Hazardous Substances (RoHS) directive restricts the use of lead in nearly all electronic components used today.
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Solder Materials
New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
New Equipment | Cleaning Agents
IONOX® I3955 is a precision vapor cleaning solvent designed as a drop in replacement for modern era vapor degreasing equipment. IONOX® I3955 is effective in removing no clean and rosin flux residues from electronic assemblies including low stand-off
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
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