Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Equipment
The Hakko FR-1418 BGA Rework System is constructed of heavy-walled aluminum castings for unsurpassed precision and stability and uses precisely controlled solder reflow profiles. The system features a unique gantry style construction similar to that
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Board Handling - Storage
Eureka TD-1001 Fast Super Dryer Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/td-1001 Capacity: 657 Liters Humidity Range: LESS THAN 20% Recovery Time: Recovers to ≤ 20% RH within 30 minutes after accessing door for 30 s
New Equipment | Board Handling - Pallets,Carriers,Fixtures
This unique full process carrier can run thru screen printing, pick & place, reflow soldering, vision inspection and X-ray inspection. The PCB can be set to the center on the y axis and flush too slightly above the top surface of the carrier for scr
ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide. Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref
New Equipment | Board Handling - Storage
Effective moisture damage solution that improves yields. http://eurekadrytech.com/fast-super-dryer/tus-101 Capacity: 93 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing door for 30 seconds or les
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
