New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
Automatic Ball Bonder for high pin count devices, complex multichip modules, fine-pitch hybrid microcircuits, ceramic circuit boards,Chip-on-board, and Chip-on-flex.
High Speed, Large Area (12in x 6in.) Ball bonder with Continuous Bonding Technology.
New Equipment | Assembly Services
KULICKE & SOFFA 1419-3- WIRE BONDER PART MACHINE
Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.
For Wire Bonding (Wedge and Ball Bonding)
Pulsed Heat Hot Bar Bonders, Computerized Control Systems, FPD Workstations
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
3D Printers Rapid Prototyping Equipment Semiconductor Equipment - Rework Stations - Wire Bonders - Palomars, Orthodyne, Delvotec
