4000675 TIMING BELT XM 2 40001116 TIMING BELT T 4 40001143 TIMING BELT Z 4 40001160 TIMING BELT IC Z 1 40000947 TIMING BELT 1 40001023 TIMING BELT(L) 1 40001023 TIMING BELT(L) 1 E2155725000 AWC BELT (M/L) 1 E2160725000 AWC BELT (E) 1
=0.7%/C. 2. Excellent long term stability, annual diversification rate max. 0.01C per year, temperature drifts during the lifetime of silicon temperature sensor are negligible. 3. Thermal Time Constant 10 seconds max in still air. 4. Operating temper
CJ1W-MD232 CJ1W-MD232 CJ1W-MD233 CJ1W-MD233 CJ1W-MD261 CJ1W-MD261 CJ1W-MD263 CJ1W-MD263 CJ1W-MD563 CJ1W-MD563 CJ1W-NC113 CJ1W-NC133 CJ1W-NC213 CJ1W-NC233 CJ1W-NC413 CJ1W-NC433 CJ1W-NCF71 CJ1W-OC201 CJ1W-OC201 CJ1W-OC211 CJ1W-OC211 CJ1W-OD201 CJ1W-OD
The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli
CX-411/CX-412/CX-491/CX-493/CX-424/CX-421/ CX-422/CX-423/CX-441/CX-442/ EX-31A/EX-31B/EX-32A/EX-32B EX-21A/EX-21B/EX-23/EX-29A/EX-29B/EX-22A/ EX-22B/EX-24A/EX-24B/EX-26A/EX-26B/EX-28A/EX-28B/ EX-15E/EX-17E /EX-14B/ EX-15/EX-14A EX-11A/EX-11B/EX-13
sales@allwin21.com The AW-901eR & AW-903eR single-wafer dry etchers are automated tools designed as a flexible 13.56MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW-901eR & AW-903eR are in direct response to manufac
D4C-1531 D4C-1532 D4C-1533 D4C-1550 D4C-1601 D4C-1602 D4C-1603 D4C-1610 D4C-1620 D4C-1624 D4C-1631 D4C-1632 D4C-1633 D4C-1641 D4C-1650 D4C-1701 D4C-1702 D4C-1703 D4C-1720 D4C-1731 D4C-1732 D4C-1733 D4C-1743 D4C-1750 D4C-1801 D4C-1802 D4C-1803 D4C-182
NSW Automation design and manufacture fluid dispensing system and solutions. Dispensing process is achieved by various delivery method (dotting, casting, sealing, filling, jetting etc) to meet process requirements. Application range from LED, COB, Se
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
~1485G-P6N5-C 1485G-P6N5-M5 1485G-P6R5-C 1485G-P6R5-D5 1485GF-P1N5-M5 1485GF-P2N5-M5 1485GF-P3N5-M5 1485GF-P4N5-M5 1485GF-P5N5-M5 1485GF-P6N5-M5 1485K-P1F5-C 1485K-P1F5-N5 1485K-P1F5-R5 1485K-P1F5-V5 1485K-P1F5-Z5 1485K-P1FD5-D5 1485K
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