New SMT Equipment: chip strength (Page 1 of 3)

RollPruf

New Equipment |  

RollPruf tri-polymer blend of neoprene, nitrile and natural rubber in 8 mil, hand specific design provides optimum comfort, reduced hand fatigue, with durability and strength uncommon to latex gloves. Applications: Chip Assembly Photomask Assembly Ph

MAPA Professional

Copper Bonded Earth Rod

Copper Bonded Earth Rod

New Equipment | Components

We manufacture Copper Bonded Earth Rods from high tensile-low carbon steel compiling with requirements of BS 4360 Grade 43 A. Each Copper Bonded Earth Rod is molecularly bonded by 99.99% pure, high conductivity copper bonding, each rod is treated wit

Brass Neutral Links

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G / SM-155P Single Component Epoxy Adhesive

New Equipment | Solder Materials

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process

Shenmao Technology Inc.

Henkel Surface Mount Adhesives

Henkel Surface Mount Adhesives

New Equipment | Materials

As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app

Henkel Electronic Materials

Surface Mount Epoxy 4089

Surface Mount Epoxy 4089

New Equipment | Dispensing

Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure, 

AIM Solder

BP 256 Ball Attach Adhesive

BP 256 Ball Attach Adhesive

New Equipment | Materials

BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During

YINCAE Advanced Materials, LLC.

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

Electric Dry Cabinet 10507L

Electric Dry Cabinet 10507L

New Equipment | Board Handling - Conveyors

Detailed Product Description   Capacity: 157L   Outside size:W440*D450*H935mm   Inside size: W436*D420*H877mm   RH range: 20%-60%RH   Display: Microcomputer LCD display   Shelves: 3   Power consumption: av 16W   Voltage: 110-220V Character

HuiKe Tech

Ultro-low Anti Static Dry Cabinet 40800LA

Ultro-low Anti Static Dry Cabinet 40800LA

New Equipment | Board Handling - Conveyors

Detailed Product Description   Capacity: 480L   Outside size:W600*D700*H1276mm   Inside size: W596*D670*H1218mm   RH range: 1%-40%RH   Display: Microcomputer LCD display   Shelves: 3   Power consumption: av 32W   Voltage: 110-220V Characte

HuiKe Tech

Electric Dry Cabinet 1040503L

Electric Dry Cabinet 1040503L

New Equipment | Board Handling - Conveyors

Detailed Product Description   Capacity: 1453L   Outside size:W1200*D700*H1885mm   Inside size: W1196*D670*H1827mm   RH range: 1%-40%RH   Display: Microcomputer LCD display   Shelves: 5   Power consumption: av 96W   Voltage: 110-220V Chara

HuiKe Tech

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