New SMT Equipment: co-planarity (Page 1 of 1)

Reflow Soldering and Bonding Heads

New Equipment |  

This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.

Unitek Equipment

Amfax a3Di laser based PCBA metrology inspection system

Amfax a3Di laser based PCBA metrology inspection system

New Equipment | Inspection

Amfax a3Di is not an AOI (Automated Optical Inspection) system. It is a revolutionary laser based metrology measurement system that enables you to find faults on your populated PCB assemblies like never before. The extremely accurate measurement capa

Amfax Limited

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

Eclipse Industries

New Equipment |  

Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of

Eclipse Industries

C-TurnFlux - Automated Flux Dispensing and Hot Bar Reflow Soldering

C-TurnFlux - Automated Flux Dispensing and Hot Bar Reflow Soldering

New Equipment | Soldering Robots

The C-TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality inspection are required. A motorized, five position ind

C-Tech Systems, B.V. [formerly Nordson DIMA]

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