Urethane, Epoxy, Lacquer and Water-borne coatings applied to plastic and metal substrates.
New Equipment | Solder Materials
Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including
Tungsten and Molybdenum Boats Typical application Lighting Technology:lamp electrodes for creating the arc in discharge lamps, filament wire for halogen lamps, tubes for annealing filament wires, Evaporation boats for coating cold-light reflect
Sync in/out cable, 7 Pin Mini-DIN connector on one end and an 8 Pin Mini -DIN connector on the other, 1.5 ft Length (FM3/4 to FM3/4) SP1201-LCD Unidrive SP with LCD Keypad, 230Vac, Max Cont Output Current (hp): Normal Duty - 5.2A (1.5hp), Heavy Duty
New Equipment | Coating Equipment
DC Series – Conformal Coat Dip Systems (Lab, Bench-top, In-line) SB Series – Conformal Coat Spray Booth Systems CR Series – Conformal Coat Removal Systems G3 Dispensing - Automatic Robotic – liquids, pastes or gels
Pure tungsten sheet, plate, tungsten alloy sheet, plate. Alloy Sheet(thickness) W1 0.5-8.0 CW1 0.5-8.0 W2 0.5-8.0 WAl1 0.5-8.0 WAl2 0.5-8.0 WAl3 0.5-8.0 WCe15 0.5-8.0 WTh7 0.5-8.0 WTh10 0.5-8.0 WTh15 0.5-8.0 Wl10 0.5-8.0 W-Ni-Fe 0.5-8.0
Tungsten and Tungsten Alloy Bars&Rods Alloy Bar W1 ����2.0 CW1 ��2.0-5.0 W2 ����2.0 WAl1 ��2.8-11.0 WAl2 ��2.8-11.0 WAl3 ��2.8-11.0 WCe15 ��1.0-10.0 WTh7 ��0.8-2.8 WTh10 ��2.8-10.0 WTh15 ��2.8-10.0 Wl10 ��2.8-10.0 W-Ni-Fe ����5.0 W-Ni-
New Equipment | Board Handling - Pallets,Carriers,Fixtures
WAVE SOLDER PALLETS, PROCESS CARRIERS, REFLOW FIXTURES, SELECTIVE SOLDER FIXTURES, SURFACE MOUNT CARRIERS, CONFORMAL COATING FIXTURES, ADJUSTABLE FIXTURES, CUSTOM TOOLING AND FIXTURES, MACHINING SERVICES WWW.EMCGTI.COM Check out our FACEBOOK Pa
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
