For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
Leading optoelectronics companies are looking to PROMEX for their outsource manufacturing needs. Our core competencies in microelectronics assembly technologies compliment our thorough understanding of high-speed circuit layout and process engineerin
1. The machine Special design for the IC sealing technical. 2. Heating temperature control device with Japan. Keep the temperature between dispensing end and basic board. Tolerance +/-1�� 3. Directly take the COB black glue into the tank, pick-a
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
New Equipment | Assembly Services
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
New Equipment | Industrial Automation
Part Number Part Type Description 07 AA 60 R1 GJV 30 743 65 R1 Analog Output Module 07 AA 61 R1 GJV3074366R1 07AA61R1 Analog Output Module - 4-20ma 07 AA 62 R1 GJV 30 743 Analog Output Module 07 AA 63 GJV3074368R1 Analog Output Module 07 AA 65 R
New Equipment | Industrial Automation
Part Number Part Type Description 07 AA 60 R1 GJV 30 743 65 R1 Analog Output Module 07 AA 61 R1 GJV3074366R1 07AA61R1 Analog Output Module - 4-20ma 07 AA 62 R1 GJV 30 743 Analog Output Module 07 AA 63 GJV3074368R1 Analog Output Module 07 AA 65 R
| 1 |
