New SMT Equipment: cob process (Page 1 of 2)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

SMT Assembly, Aluminum Bonding Wire

New Equipment |  

Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole

Advanced Electronics Co.,Ltd.

i-DR Series Fluid Delivery System - Designed for Highest Flexibility & Ultimate Performance

i-DR Series Fluid Delivery System - Designed for Highest Flexibility & Ultimate Performance

New Equipment | Dispensing

NSW Automation design and manufacture fluid dispensing system and solutions. Dispensing process is achieved by various delivery method (dotting, casting, sealing, filling, jetting etc) to meet process requirements. Application range from LED, COB, Se

NSW Automation Sdn Bhd

Optoelectronics

New Equipment |  

Leading optoelectronics companies are looking to PROMEX for their outsource manufacturing needs. Our core competencies in microelectronics assembly technologies compliment our thorough understanding of high-speed circuit layout and process engineerin

Promex Industries, Inc.

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

Qualitek Electronics (M) Sdn Bhd

New Equipment |  

Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa

Qualitek Electronics (M) Sdn Bhd

Microelectronics Packaging

Microelectronics Packaging

New Equipment | Assembly Services

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

High Force ACF Bonder

High Force ACF Bonder

New Equipment | IC Packaging

Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha

Finetech

ABB 07KT92 GJR5250500R0262  Central Processing Unit - 90 Series

ABB 07KT92 GJR5250500R0262 Central Processing Unit - 90 Series

New Equipment | Industrial Automation

SANDY.[MAILTO:UNITY@MVME.CN]    SANDY.[WHATSAPP/SKYPE/MOBILE:+8618020776786]     SANDY.[QUOTE TO YOU WITHIN THE SHORTEST POSSIBLE TIME WITH OUR BEST PRICE]   WARRANTY: UP TO 12 MONTHS SHIPPING: FAST DELIVERY IS AVAILABLE NEW+ORIGINAL+IN STOCK+ONE YE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

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cob process searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

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