New SMT Equipment: coplanarity height (Page 1 of 1)

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

KOH YOUNG Zenith UHS 3D AOI

KOH YOUNG Zenith UHS 3D AOI

New Equipment | Test Equipment

KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t

Qersa Technology Co.,ltd

Coplanarity Service / Lead Straightening

Coplanarity Service / Lead Straightening

New Equipment | Rework & Repair Equipment

Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles.  The goal of lead restoration is not to mimic "l

Process Sciences, Inc.

Amfax a3Di laser based PCBA metrology inspection system

Amfax a3Di laser based PCBA metrology inspection system

New Equipment | Inspection

Amfax a3Di is not an AOI (Automated Optical Inspection) system. It is a revolutionary laser based metrology measurement system that enables you to find faults on your populated PCB assemblies like never before. The extremely accurate measurement capa

Amfax Limited

SQ3000™ Fastest 3D AOI In the Industry

SQ3000™ Fastest 3D AOI In the Industry

New Equipment | Inspection

The Ultimate in Speed and Accuracy. SQ3000 3D Automated Optical Inspection (AOI) system maximizes ROI and line utilization with 3D multi-view sensors that enable fastest 3D inspection in the industry. SQ3000 incorporates Multi-Reflection Suppression

CyberOptics Corporation

Ultra 850XB BGA and Packaging AOI

Ultra 850XB BGA and Packaging AOI

New Equipment | Inspection

Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def

Machine Vision Products, Inc

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us

Akrometrix

S6056 - Extremely fast and precise - High-end AOI and High-end 3D AOI

S6056 - Extremely fast and precise - High-end AOI and High-end 3D AOI

New Equipment | Inspection

The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual

Viscom AG

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