Our edge-hardened, pre-sharpened knife steel, which we refer to it as �Presharp,� is a high technology, lead-hardened steel that has revolutionized the die-making process. One of Austria�s oldest and most respected steel mills developed a unique proc
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cra
Plastic anti static ic tubes and aluminum rails for shipping sensitive parts, and black conductive for storage and shipping of delicate semiconductors integrated circuits chips and other electronic devices. Anti-static, wafer packaging, plastic anti-
A spring contact is any part that is used to connect, or keep distance between, two separate parts. These parts can be used to transfer current between the power source and the load on a circuit board. There are a wide variety of applications for suc
EMI/RFI shielding is used for a wide array of devices for protection from electronic and radio interference. Any device that has a circuit board and is sensitive to electro-magnetic and/or radio-frequency interference, then shielding should be a cons
Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
& D AD-4714A INFRARED MOISTURE DETERMINATION BALANCE A & D COMPANY AD-4316 INDICATOR A & D COMPANY AD-4322A INDICATOR A & D COMPANY AD-4323 INDICATOR A B DICK SEE VIDEOJET A B DICK 84-100-00/B MODEL 1200 ENVELOPE FEEDER BD A C
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