New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
New Equipment | Cleaning Equipment
Automatick Ultrasonic Stencil Cleaner BMP-1200 ▶All stainless steel body: beautiful, wear resistance, corrosion resistance, acid, alkaline and other cleaning fluid. Meet environmental protection requirements and standards. ▶Full pneumatic operation,
40° Cutting speed 300-500/s Blade material High speed steel Air pressure 0.5-0.8Mpa Voltage 220/110V Dimension 1250(1560)mm×800mm×1295mm Packaging weight 300kgs PCB Sepa
Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a
2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
2.0 Cpk @ +/- 12.5µm, (±6 Sigma) * Process Alignment Capability >2.0 Cpk @ +/- 25µm, (±6 Sigma) * Standard cycle time 10 seconds + process Maximum printing surface 508 mm (X) × 508 mm (Y) User interface Touchscreen, keyboard a
New Equipment | Soldering Robots
Description: Hot bar soldering is extremely effective in bonding components and parts that are dissimilar and difficult to unite. Several examples are listed above, but there are many other soldering situations that call hot bar reflow soldering sys
