New SMT Equipment: fiducial camera for sm320 (Page 1 of 1)

HCT-530SV 8 Heads SMD Placement Machine for LED SMT Processing

HCT-530SV 8 Heads SMD Placement Machine for LED SMT Processing

New Equipment | Pick & Place

Offering HCT-530SV semi-automatic LED Chip Mounter / LED Pick and Place Machine. * Placement rate (optimized) 42,000CPH * 8 placement heads * Maximum PCB size 1500×400mm * Placement accuracy: ±0.05mm * Component range: 0603~5050~7474,

Shenzhen HanChengTong Technology Co.,Ltd

HCT-600SV Full Automatic LED Chip Mounter for PCB Electronics Assembly

HCT-600SV Full Automatic LED Chip Mounter for PCB Electronics Assembly

New Equipment | Pick & Place

Offering HCT-600SV full automatic LED Chip Mounter / LED Pick and Place Machine. * Placement rate (optimized) 40,000CPH * 8 placement heads * Maximum PCB size 600×380mm * Placement accuracy: ±0.05mm * Component range: 0603~5050~7474, hi

Shenzhen HanChengTong Technology Co.,Ltd

HCT-330SV 6 Heads SMD Pick and Place Machine for LED Board Assembly

HCT-330SV 6 Heads SMD Pick and Place Machine for LED Board Assembly

New Equipment | Pick & Place

Offering HCT-330SV semi-automatic LED Chip Mounter / LED Pick and Place Machine. * Placement rate (optimized) 36,000CPH * 8 placement heads * Maximum PCB size 1500×390mm * Placement accuracy: ±0.05mm * Component range: 0603~5050~7474, h

Shenzhen HanChengTong Technology Co.,Ltd

Condor Sigma W12 Bond Tester - Ideal Solution for 300mm (12 inch) Wafer Testing

Condor Sigma W12 Bond Tester - Ideal Solution for 300mm (12 inch) Wafer Testing

New Equipment | Test Equipment - Bond Testers

Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av

XYZTEC bv

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