With the rapid development of the electronics industry, integration chips are increasing, there are some troubles for small screen printing machines: 1 working table. The working table cant meet high accuracy; 2 manual scraper. There are error in a
Features 1. PC control ,touch screen display and menu operation interface 2. Floating scraper.similar to automatic printer, the scraper can be floated freely up and down and can be adjusted automatically to level with the steel grid. 3. The pressu
Features: 1. PC control,touch screen display and menu operation interface 2. Floating scraper.similar to automatic printer, the scraper can be floated freely up and down and can be adjusted automatically to level with the steel grid. 3. The pres
Accurate repeatable printing and simple-safe operation have all been achieved with the screen printers from Mechatronic systems GmbH in Regensburg. The units are designed for fast workflow and job change over including both the pcb and frame. The equ
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Universal Board Support System for all Printers and Chipshooter, Dispensers and Placement and AOI machines. The new Red-E-Set substrate support system is designed for screen printers of single- and double-sided printed circuit boards. The patented R
Features 1. microcomputer control, touch screen display, menu operation interface. 2. scraper floating. (Similar to automatic printing presses, scraper can freely fluctuate and automatically adjusts the level of steel mesh). 3. Adjustable squeegee
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
Quick Overview Precision SMT stencil printer for fine pitch with vertical stencil separation Application: MSP-250 series is suitable for mobile phone motherboard, computer motherboards, single and double side PCB, LED display circuit boards, LED
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