According to specific needs of our clients, we provide various electronics products and related import and export service, including raw material purchase; PCB design, cloning, manufacturing, packaging, transportation, import and export. Forestec i
TW-Single-sided PCB 0028 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units pe
New Equipment | Assembly Services
TW-Multilayer PCB 0123 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
New Equipment | Assembly Services
TW-Aluminum PCB 0201 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
Visual inspection package for printed wiring assembly manufacturing. Software provides a graphical recorder for inspection/rework operators. Analysis module processes raw data and monitors line performance. VIPe comes with various built-in libraries
New Equipment | Design Services
Our design services – the total package. At i3, we are the premier supplier of leading-edge PCB and semiconductor package designs. We maintain a highly skilled team of design engineers with more than 170 years of collective experience in the desi
Multi-die system-in-package with low inductance direct attach of module to system level PCB.
Provides moisture barrier and ESD protection in "dry-packaging" of static and moisture sensitive components, PCB's and disk drive assemblies.
Create Comprehensive PCB Documentation to Drive PCB Fabrication, Assembly and Inspection BluePrint-PCB is the premier PCB document authoring solution to create the manufacturing specifications for an electronic product. Comprehensive documentation r
New Equipment | Assembly Services
PCB process capability Base material: CM1, CM3, FR1, FR4, Metal based Layer: 1 to 24 layers Board thickness: 0.4mm to 3mm Copper thickness: 0.5oZ, 1oZ, 2oZ Min Copper thickness in hole: 0.02mm Max working size: 400*610mm Surface finishing: HAS
