New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework NEW! Movable top and bottom gas heaters. NEW! All Shuttle Star BGA Rework Stations are now available with Cabinet Base on wheels. For high volume BGA Rework on even the largest computer a
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Ersa HOTFLOW 4/8 Reflow Oven Working width: 45-560 mm Process Length: 3,260 mm Length Heated: 1,525 mm Length Cooled: 1,735 mm Weight app. 1,100 kg Dimension: 3,905x1,410x1,350 mm Ersa HOTFLOW 4/8 Reflow Oven Ersa HOTFLOW 4/8 Reflow Oven High
The 7320 Epidermal Thermal Imaging Professional Series (ETI-P) camera system is a high resolution 320 X 240 uncooled focal plane array infrared camera package complete with specialized imaging analysis software. This radiometric camera package is b
New Equipment | Rework & Repair Equipment
Rapid, Safe Soldering or Desoldering on High Mass, Heat-Sinking Assemblies Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's and
Full service supplier of silicon wafers and wafer processing services, including polishing, reclaim, thermal oxide and back-grinding. Supplies silicon wafers in all specifications from 2in. to 300mm in diameter.
Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature
