New SMT Equipment: measuring coplanarity (Page 1 of 2)

KOH YOUNG Zenith UHS 3D AOI

KOH YOUNG Zenith UHS 3D AOI

New Equipment | Test Equipment

KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t

Qersa Technology Co.,ltd

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

Warpage/Coplanarity Measurement Lab Services

Warpage/Coplanarity Measurement Lab Services

New Equipment | Inspection

ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide.  Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref

ZN Technologies

core9030b

core9030b

New Equipment |  

1) Non contact Coplanarity Measuring Module with Reflow Oven 2) Coplanarity measurement for lead free & Hogh Temperature environment. 3) Due to rapid growth of "Lead free solder" usage, surface mounting parts are requested to be heated higher and be

cores korea

5K - Large Board High-Speed 3D AOI

5K - Large Board High-Speed 3D AOI

New Equipment | Inspection

The large board solution The 5K Series offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY® innovations, including Selective 3D AOI technology for accurate tilt and coplanarity measurement of ICs, connector

Vi TECHNOLOGY

SQ3000™ Fastest 3D AOI In the Industry

SQ3000™ Fastest 3D AOI In the Industry

New Equipment | Inspection

The Ultimate in Speed and Accuracy. SQ3000 3D Automated Optical Inspection (AOI) system maximizes ROI and line utilization with 3D multi-view sensors that enable fastest 3D inspection in the industry. SQ3000 incorporates Multi-Reflection Suppression

CyberOptics Corporation

Ultra 850XB BGA and Packaging AOI

Ultra 850XB BGA and Packaging AOI

New Equipment | Inspection

Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def

Machine Vision Products, Inc

Amfax a3Di laser based PCBA metrology inspection system

Amfax a3Di laser based PCBA metrology inspection system

New Equipment | Inspection

Amfax a3Di is not an AOI (Automated Optical Inspection) system. It is a revolutionary laser based metrology measurement system that enables you to find faults on your populated PCB assemblies like never before. The extremely accurate measurement capa

Amfax Limited

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us

Akrometrix

C-TurnFlux - Automated Flux Dispensing and Hot Bar Reflow Soldering

C-TurnFlux - Automated Flux Dispensing and Hot Bar Reflow Soldering

New Equipment | Soldering Robots

The C-TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality inspection are required. A motorized, five position ind

C-Tech Systems, B.V. [formerly Nordson DIMA]

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