New SMT Equipment: nickel plating wedge bond (Page 1 of 1)

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

KappRad - The Radiator Repair Solder

KappRad - The Radiator Repair Solder

New Equipment | Solder Materials

KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app

Kapp Alloy & Wire, Inc

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nickel plating wedge bond searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

Training online, at your facility, or at one of our worldwide training centers"
Blackfox IPC Training & Certification

World's Best Reflow Oven Customizable for Unique Applications
PCB Handling with CE

Smt Feeder repair service centers in Europe, North, South America
Sell Your Used SMT & Test Equipment

Stencil Printing 101 Training Course
PCB Depanelizers

"Heller Korea"