New SMT Equipment: part to part clearance (Page 2 of 5)

KappZapp4™ - Tin-Silver Solder for Stainless Steel to Stainless Steel and Copper

KappZapp4™ - Tin-Silver Solder for Stainless Steel to Stainless Steel and Copper

New Equipment | Solder Materials

KappZapp4™ contains 4% Silver (Ag), and is often preferred for hand soldering Copper wires and tabs. It has a wider slushy or plastic range (430°F-475°F and 221°C - 246°C) to allow users to manipulate parts while the solder joint is cooling and harde

Solder Direct

Taping for electronic components /diode/  6mm*500m,6mm*3000m/the tape mainly applied to masking diode etc.

Taping for electronic components /diode/ 6mm*500m,6mm*3000m/the tape mainly applied to masking diode etc.

New Equipment | Components

size:6mm*3000m Backing: flat back paper Adhesive: rubber Thickness: 0.16 ±0.01mm Adhesion (N/in): 7 Ball tack (#14): 10↓ Holding power: 72hrs Tensile strength (N/in): 150↑ Elongation (%): 2↑ Applications: used in masking of diode and for s

Shenzhen Shunyuan Tapes Co.,Ltd.

SIPLACE Di Series - Pick & Place For Small to Medium-size PCB Production

SIPLACE Di Series - Pick & Place For Small to Medium-size PCB Production

New Equipment | Pick & Place

Price-performance leader with perfect combination of high-tech innovations and proven technologies. In terms of performance and precision, the SIPLACE Di shines with innovative technologies from our high-end solutions: the digital SIPLACE vision sy

ASM Assembly Systems GmbH & Co. KG

DP80C51 - Pipelined High Performance Microcontroller 10 times faster to 8051

New Equipment | Other

Overview • 10 times faster compared to standard 8051 • Interface for additional Special Function Registers • Pipelined RISC architecture The DP80C51 is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded controll

Digital Core Design

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12")

New Equipment | Rework & Repair Equipment

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,

PACE Worldwide

KappZapp4 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper - NSF 61 Certified

KappZapp4 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper - NSF 61 Certified

New Equipment | Solder Materials

The KappZapp4 - 4% Silver formula is often preferred for hand soldering Stainless and Copper parts. It has a wider slushy or plastic range to allow users to manipulate parts during cooling. Low melting temperatures prevent loss of properties and mi

Kapp Alloy & Wire, Inc

BiRAL VG-HT (visco grease - high temperature) Operates from -20°C to +270°C. Supplied as aerosol and in unpressurised containers.

BiRAL VG-HT (visco grease - high temperature) Operates from -20°C to +270°C. Supplied as aerosol and in unpressurised containers.

New Equipment |  

BIRAL VG-HT (VISCO GREASE HIGH TEMERATURE) is sprayed on initially as a thin liquid and then it rapidly penetrates into normally inaccessable parts/components before setting to its grease consistency The fine no-drip "stay-in-place" grease film is

BIRAL USA, ADVANTAGE DIST., LLC

Selective Solder Fixtures

Selective Solder Fixtures

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Selective solder fixtures protect bottom side SMT components & eliminate the risk of loosing parts in the solder. Our unique designs will eliminate skipping and bridging. No need to tape areas which reduces operator time and speeds up your line.

MB Manufacturing

M1m AOI - Automated Optical Inspection for Microelectronics

M1m AOI - Automated Optical Inspection for Microelectronics

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH

M1 Series AOI - In-Line Automated Inspection

M1 Series AOI - In-Line Automated Inspection

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH


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