Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Equipment | Solder Materials
AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining j
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
Underfill, FPC, Glob Top, Dam & Fill, Surface Mount Adhesive, LED Packaging, BGA Edge Bonding, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated. Viscosity Contr
SMT and PCB Packaging, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated.
Increased Dispense Area over SD6 Series for Underfill, Glob Top, Dam & Fill, LED Packaging, Surface Mount Adhesive Dispensing, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down
MY600 - Millions of dots ahead of its time. The next-generation MY600 Jet Printer now enables SMT producers to achieve optimal solder joints on complex boards at speeds of more than one million dots per hour, a 50% increase in throughput compared to
iJet-Table Dispenser Model 250 & 350: SMT and PCB Packaging, Underfill, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the n
