ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide. Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
Fully Automated for High-Performance Rapid PCB Prototyping Applications: Milling/drilling 1- & 2-sided PCBs Milling/drilling RF- & microwave substrates Multilayer PCBs up to 8 layers Contour routing circuit boards Flexible and
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides support to PCB preventing substrate distortion * Prevents bottom side components from double-sided reflow * Eliminates operator intervention for screening, placement, and reflow * Transports odd-shaped PCB through conveyor * Accurately loc
Model ; SA006 ; high accurate & durable semi-automatic screen printer for fine-pitch printing for various substrate like PCB, FPCB, LTCC, etc..
New Equipment | Assembly Services
We can bump single die in geometries as small as 30um. CVI will add a UBM on aluminum and copper pads follewed by solder bump in Sn and In alloys. CVI can then attach the die to a substrate or PCB followed by complete assembly.
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New Equipment | Cleaning Equipment
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: ．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c
New Equipment | Selective Soldering
The Vitronics Soltec mySelective 6746 is a selective soldering automation workcell that has been optimized for maximum throughput and flexibility while minimizing its footprint in the factory. Inline processes and intuitive programming features enhan
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
