The 907 micro Placer series allows you to place and rework BGA, mBGA, QFP, and Flip-Chip devices quickly and accurately. This unit is quick and accurate for placing devices with the added option of built in rework. You can place and reflow devices w
PROsentry monitors and reports all the critical parameters of your soldering process enabling total quality monitoring of every product produced. Time stamped data is generated and stored to allow any parameter, on any product, at any time to be rec
Origin: China Price: To Talk About Specification: 1)Thickness Of Silver Plating:From 2Um-15Um 2)Material:ABS or PBT 3)Cu-Ni-Silver 4)Earth Module,Profile Module,Profile Switching Module,Disconnection Module,Connection Module 5)Different Colors are
Technical Specifications Memory : 18,000 readings per channel Sampling interval : 0.05 sec to 10 min Accuracy : �0.5�C Resolution : 0.1�C Max internal operating temp : 85�C Data collection : start Start/stop buttons, time or temperature trigger B
New Equipment | ESD Control Supplies
10ft long ground cord terminated by a banana plug and low-profile 10mm male snap. Conveniently attaches to other surfaces with a 10mm female snap. Low-profile 10mm male snap High strength tinsel wire Banana plug terminated Black UL listed
New Equipment | ESD Control Supplies
15ft long ground cord terminated by a banana plug and low-profile 10mm male snap. Conveniently attaches to other surfaces with a 10mm female snap. Low-profile 10mm male snap High strength tinsel wire Banana plug terminated Black UL listed
Wide variety of styles including Peel-A-Way� low profile removable carrier, high density molded connectors, and more. Patented features such as solder preforms and screw-machined terminals offer high reliability.
Hundreds of standard and interstitial footprints. Many terminal and wafer options including Peel-A-Way� low-profile, removable carriers and high temperature molded wafers.
Profile Thermocouples for both horizontal and vertical diffusion furnaces, LPCVD, CMOS, ... Spike heaters based on Thermocouples
From plastic sockets to ceramic BGA components, the Chipmaster Rework system provides a controlled environment, which cares for your repair process. Features simple operation with "Timed" process control and selected thermal profiling
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