IPC-8 series reflow oven adopts advanced technology and inspection standard of IPC-985X (evaluation of reflow oven), which fully satisfy the temperature profile requirement of IPC-7530 (Guidelines for Temperature Profiling for Mass Soldering Processe
Accurately senses component temperatures without soldering or taping! TEMPROBE™ is a patented, precision temperature sensing instrument. The subminiature thermocouple tip can be placed anywhere on a board, including profiling in wet solder paste or
Do you demand the highest density of thermocouples placement possible on your Hi-Reliability, High-Value PCB? ECD's got your Spec! Do you expect a software package that flexes with your workflow, providing customizable data extractions, Imports of yo
New Equipment | Rework & Repair Equipment
Rapid, Safe Soldering or Desoldering on High Mass, Heat-Sinking Assemblies Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's and
The MEGARIDER™ family helps you to know more about the behavior of your oven. Use them to characterize for development, verify for production, or qualify pre-purchase. Equal masses across the width of the boards, permit PCB-like profiles that give in
Higher throughput reflow oven with 20" (508mm) wide conveyor for production runs. The 2000HT reflow oven utilizes our patented Horizontal Convection Heating technology for extremely uniform temperature profiling across the board for enhanced process
The “PTP® VP-8” is a complete thermal profiling solution for the vapor phase solder process, using the award winning, M.O.L.E.® MAP software, in combination with the German-Engineered PTP® Vapor Phase profiler. This match-up provides all the power &
PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
PRO 1600-B is a benchtop full forced air convection reflow oven. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600-B is very flexible in terms of profil
New Equipment | Rework & Repair Equipment
The Hakko FR-1418 BGA Rework System is constructed of heavy-walled aluminum castings for unsurpassed precision and stability and uses precisely controlled solder reflow profiles. The system features a unique gantry style construction similar to that
