New SMT Equipment: reflowing previous solder joints (Page 4 of 4)

M.O.L.E.® MAP Thermal Profiler Software

M.O.L.E.® MAP Thermal Profiler Software

New Equipment | Software

M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E

Electronic Controls Design Inc. (ECD)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

2K - Compact, High-Speed and Affordable AOI

2K - Compact, High-Speed and Affordable AOI

New Equipment | Inspection

The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well as lifted lead inspection and sensitive solder joints & bridges. The 2K Series improve

Vi TECHNOLOGY

Agilent Medalist SP50 Series 3 - SPI

Agilent Medalist SP50 Series 3 - SPI

New Equipment | Inspection

Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th

Agilent Technologies, Inc.

AQUANOX® A4520 - Aqueous All Temperature Electronics Cleaner

AQUANOX® A4520 - Aqueous All Temperature Electronics Cleaner

New Equipment | Cleaning Agents

Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa

KYZEN Corporation

IR-E6 Evolution BGA Rework Station for PCB's up to 24

IR-E6 Evolution BGA Rework Station for PCB's up to 24

New Equipment | Rework & Repair Equipment

Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg

PDR-America

S6056 - Extremely fast and precise - High-end AOI and High-end 3D AOI

S6056 - Extremely fast and precise - High-end AOI and High-end 3D AOI

New Equipment | Inspection

The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual

Viscom AG

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