New SMT Equipment: slump (Page 1 of 1)

Solder Paste

New Equipment |  

Long stencil life, Excellent Printing, Minimum slump, High surface insulation resistance, Long tack life.

Promosol Asia Pacific Sdn. Bhd.

SPA 1000 Solder Paste Analyzer

SPA 1000 Solder Paste Analyzer

New Equipment | Solder Materials

SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.

Ascentech LLC

SMD Adhesives - Epibond�

New Equipment |  

Epibond� 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non st

Cookson Electronics

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

WS159 - Water Soluble Solder Paste

WS159 - Water Soluble Solder Paste

New Equipment | Solder Materials

WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of

FCT ASSEMBLY, INC.

SN100C Solder Paste Products

SN100C Solder Paste Products

New Equipment | Solder Materials

FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec

FCT ASSEMBLY, INC.

MULTICORE Solder Pastes

MULTICORE Solder Pastes

New Equipment | Solder Materials

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr

Henkel Electronic Materials

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

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