New SMT Equipment: smd shear force test (Page 1 of 2)

JUKI JM-20 Hybrid Placement Machine

JUKI JM-20 Hybrid Placement Machine

New Equipment | Pick & Place

JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603~50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603~50mm, Place Speed:15,500 CPH  

Qersa Technology Co.,ltd

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

4000 Series Bond Testers

4000 Series Bond Testers

New Equipment | Test Equipment - Bond Testers

Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon

Nordson DAGE

Peel Force Tester

Peel Force Tester

New Equipment | Tape and Reel Equipment

Peel Force Tester Model: PL425 Specification: Peel angel: 165-180 degree Pull length: 50-200mm Japan ALGOL electronic Rally: display range MAX 1000.0 gf. Test speed: Max 300mm / min Power: single-phase AC 110V / AC 220V. Dimensions (mm): Le

Plastlist Group

Condor Sigma Bond Tester

Condor Sigma Bond Tester

New Equipment | Test Equipment - Bond Testers

The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options,

XYZTEC bv

Surface Mount Device Tape and Reel Service

Surface Mount Device Tape and Reel Service

New Equipment | Tape and Reel Services

Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most compani

Syagrus Systems

Cover Tape

Cover Tape

New Equipment | Tape and Reel Services

Plastlist Carrier Tape& Reel® Cover Tape Cover tape is sealed to the carrier tape to hold the devices in the pockets. Plastlist Carrier Tape& Reel® offers a full range of heat activated and pressure sensitive cover tapes to deliver desired

Plastlist Group

IR-E6 Evolution BGA Rework Station for PCB's up to 24

IR-E6 Evolution BGA Rework Station for PCB's up to 24

New Equipment | Rework & Repair Equipment

Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg

PDR-America

PRO1600-RS Reflow Simulator

PRO1600-RS Reflow Simulator

New Equipment | Reflow

PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi

Advanced Techniques US Inc. (ATCO)

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