New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printing
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Cleaning Equipment
smt stencil clean roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Most MPM pr
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Stencil Clean Rolls: Machine Specification Core MINAMI ￠8mm*270mm*6m Plastic Core: 290mm EKRA ￠13.5mm*300mm*7m Paper Core:400mm ￠13.5mm*400mm*7m Paper Core:400mm MPM ￠19.5mm*250mm*10m Paper Core:455mm ￠19.5mm*300mm*10m Paper Core:455mm ￠19.5m
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Product Desciption: 1.stencil clean rolls are Suitable for SMT machines of MPM, DEK, JUKI, ERKA, FUJI, SANYO, YAMAHA, Panasonic, KME and Minami brands 2.Wiper material: 56g, 65g, 68g, PGI55g, Mesh cloth. Material designed specifically for SMT screen
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New Equipment | Cleaning Equipment
description 1. Esocoo is made of high-quality woodpulp polyester spunlaced nonwovens 2. Prime cleaning performance 3. Excellent absorption with water and solvent 4. Lint-Free and no scratch to printer surface 5. High tensile strength MINAMI, DEK, MPM
