New Equipment | Coating Equipment
The Viscosity Control System maintains consistent temperature of conformal coating fluids. The system includes a heated recirculating fluid circuit to eliminate viscosity changes in temperature-responsive materials. Close-range temperature monitoring
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
The art of combination. . . the essence of thin film technology. Since 1980 Thin Film Technology has been designing and manufacturing thin film components in an ISO9001 certified operation. From this factory quality product serving the computer, test
The EDX-720 is a high-performance general-purpose instrument with several features optimized to enhance performance for demanding regulatory compliance measurements such as RoHS and ELV. The EDX-720 is equipped with the following standards features:
Full range of Platinum RTD in thin film technology, glass wire wound RTD's, ceramic wire wound RTD's, ...customised complete RTD assemblies
Founded in 1928, Stackpole Electronics is a leading global manufacturer of resistive components including Thick and Thin Film Surface Mount resistors, Axial Leaded and Wirewound resistors, Current Sense resistors, Varistors, Inductors and various Po
RollPruf tri-polymer blend of neoprene, nitrile and natural rubber in 8 mil, hand specific design provides optimum comfort, reduced hand fatigue, with durability and strength uncommon to latex gloves. Applications: Chip Assembly Photomask Assembly Ph
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
Our LCDs are manufactured using COG (Chip On Glass), COB (Chip On Board), TAB (Tape Array Bonding) and COF (Chip On Flex) technology. From small graphic units suitable for cell phones to character modules for industrial use to larger TFTs (Thin Film
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